ZEVAC AG
Vogelherdstrasse 4
CH-4500 Solothurn

Tel: +41 32 626 20 80
Fax: +41 32 626 20 90
E-mail: info@zevac.ch

ONYX 21

The ONYX 21 offers high professional rework capabilities at a favourable price. For smaller printed circuit boards and simple applications with the goal to have high reliable solder results.
ONYX 21



TECHNICAL DESIGN

The ONYX 21 has been designed according to applications requirements in a compact machine design. The compact machine design nevertheless doesn't make compromise on the functionality: it offers force measurement, strong top and bottom heating, nitrogen connection and modularity as a standard.

STRONG TOP AND BOTTOM HEATING

The preheater 300x300mm offers powerful 3500 W for bottom heating and 2000 W for top heating. Important for higher temperatures and exact temperature profiling for leadfree applications.
ONYX 21 KEY FEATURES SUMMARY
  • AXIS MOVEMENTS
    motorised Vision- and z-axis,  closed loop motion control
  • COMPACT, STABLE DESIGN
    for smaller boards, but also capable of handling boards up to 300x400mm
  • STRONG TOP AND BOTTOM HEATING
    2000 W top site heater; 3500 W 300x300mm bottom side preheating
  • BOARD COOLING
    the board cooling options adds benefits for leadfree soldering and faster process times.
  • EXTERNAL SITE SOLDER CLEANING SYSTEM
    option for external site solder removal system for redressing after removal of component
  • CLOSED LOOP AIRFLOW CONTROL
  • STANDARD ZEVAC GAS NOZZLES
  • 4 THERMOCOUPLE PORTS
    to control process temperatures.
  • FORCE MEASUREMENT
    Closed loop force control for automatic picking, fluxing, placing and removing.
  • VISION
    Available as SFOV or MFOV Version, the Vision System allows viewing of the board layout and the component pattern at the same time, adjustable Vision LED illumination intensity.
Force Placement

IR Preheater



External Site Cleaning Option

The external site cleaning option with an adjusted fixed height is outlined for use on the ONYX 21 for contactless site cleaning after removal of a component. The residue solder is removed without touching or damaging the surface of the printed circuit board. The site is cleaned and ready for a new component to be soldered in after applying flux and paste if necessary.

Force placement

The Z-axes is motorized and places the the component automatically with force in the gramme range onto the board to protect sensitive components.

ir preheater

For controlled and strong preheating and avoiding warpage. With this and the optional board cooling the cycle time can be reduced to a minimum and the temperature profile does meet the requirements even of sophisticated applications. 
NEWS

ZEVAC at SMT 2016 in Nuremberg

Visit ZEVAC at SMT Show in Nuremberg from 26th of April until 28th of April 2016 at booth 361 in hall 7. more


Office Hours Holiday Season 2015/2016

Check the ZEVAC office hours over the holiday season here: more


Season's Greetings

Merry Christmas and a happy New Year! more



AWARDS

ZEVAC has been appreciated for the arisen co-operation by Intel with the Recognition Award.
more


The ONYX 25 has been nominated by the Jury of the Designpreis for 2007.
more


Reddot design award 2006 for the selective soldering and desoldering system ONYX 25.
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