ZEVAC – WE MAKE YOUR PRODUCTS WORK

ZEVAC develops and produces machines for the component placement and the component interconnection technology including soldering processes, focusing on printed circuit board repair systems within the manufacturing process  of the electronics industry.

Development: 100% in Switzerland – Production: 95% in Switzerland


May 2019: Launching of the new ONYX MILLING machine

The ONYX MILLING machine will be presented the first time during the SMTconnect in Nueremberg, Germany (May 7th to 9th 2019). Precise mechanical removal of SMD-Parts surrounded with underfill without any impact of heat.

Precise process accuracy, precision in μm

The rest solder between the printed circuit board and the component can be removedThe rest solder between the printed circuit board and the component can be removedmechanically and gently up to an exact definable height.

High frequency precision spindle 80`000 min-1
Entire process without any tool change
A clean surface results, perfect for the placement and soldering of new components
  • Precise process accuracy, precision in μm
  • The rest solder between the printed circuit board and the component can be removedThe rest solder between the printed circuit board and the component can be removedmechanically and gently up to an exact definable height.

  • High frequency precision spindle 80`000 min-1
  • Entire process without any tool change
  • A clean surface results, perfect for the placement and soldering of new components

Upcoming exhibitions


Zevac Messe Enova
Nantes, France, April 03 - 04, 2019

Zevac Messe SMT 2019
Nuremberg, Germany, May 07 - 09, 2019



ZEVAC AG
Vogelherdstrasse 4
CH-4500 Solothurn

T  +41 32 626 20 80
F  +41 32 626 20 90
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