TECHNICAL DESIGN The SSM 9 is ideal for a wide range of soldering applications.
reproducible results Parameters like solder temperature, cycle time, wave height, ramp up and down can be programmed to realize operator independent and reliable solder results. The parameters are entered via the operating panel and up to 10 programs can be stored and repeated on demand.
|SSM 9 KEY FEATURES SUMMARY
For repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.
For easy and fast positioning of the printed circuit board over the flow well, ready for the through hole rework process.
preheater module ph4
The selective soldering and desoldering machine SSM 9 can be combined with the standalone preheater module PH4 to preheat the printed circuit board smoothly up to the predefined working temperature. Detail description PH4.