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ZEVAC AG
Vogelherdstrasse 4
CH-4500 Solothurn

Tel: +41 32 626 20 80
Fax: +41 32 626 20 90
E-mail: info@zevac.ch

SSM 4A

For selective soldering and desoldering of Through Hole Technology applications. Reproducible results by operation parameters.

TECHNICAL DESIGN

The SSM 4A is the medium machine version of the SSM series, it offers options like machine board holder support, cover, blow out system and connection to an external fume exhaust system. Reproducible results as parameters like solder temperature, cycle time, wave height, ramp up and down can be set to realize operator independent and reliable solder results. Footswitch control available on demand.

Application Range

SSM 4A KEY FEATURES SUMMARY

FLEXIBLE SOLUTIONS
for standard or odd shaped components
PROGRAMMABLE PARAMTERS
HEIGHT ADJUSTMENT
easy height adjustment of the printed circuit board over the flow well
STABLE CONSTRUCTION
easy to use and stable table top machine.
BOARD HOLDER
even irregular shaped printed circuit boards up to 600x600mm can be fixed on the quick locking board holder.
BLOW-OUT OPTION
to clean the solder joints after removal of a connector.
APPLICATION SPECIFIC TOOLING
for any kind of component also on dense populated board, including multi soldering solutions, for wetting on defined positions.
PREHEATER MODULE PH4
The standalone preheater module PH4 can be connected, especially for the increased lead-free requirements.
RETROFIT FOR LEADFREE
leadfree retrofit for machines already in operation available.

Application range

For repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.

wave height adjustment

The height of the solder wave to the solder joints can be precisely adjusted to the required distance.

preheater module ph4

Also the selective soldering and desoldering machine SSM 4A can be combined with the standalone preheater module PH4 to preheat the printed circuit board smoothly up to the predefined working temperature.

NEWS

ZEVAC at SMT 2018 in Nuremberg

Visit ZEVAC at SMT Show in Nuremberg from 5t until 7th of June 2018. more

ZEVAC at Productronica 2017 in Munich

Visit ZEVAC at Productronica Show in Munich from 14th of November until 17th of November 2017 at booth 277 in hall A4. more

ZEVAC at Enova 2017 in Paris

Visit ZEVAC at SMT Show in Paris from 18th of September until 21th of September 2017 at booth Q10. more

AWARDS

ZEVAC has been appreciated for the arisen co-operation by Intel with the Recognition Award.
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The ONYX 25 has been nominated by the Jury of the Designpreis for 2007.
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Reddot design award 2006 for the selective soldering and desoldering system ONYX 25.
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